ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,536,108, issued on Jan. 27, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Storage device, operation method of the stor... Read More
ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,533,244, issued on Jan. 27, was assigned to Globus Medical Inc. (Audubon, Pa.). "Expandable fusion device and method of installation thereof" w... Read More
ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,533,115, issued on Jan. 27, was assigned to BOSTON SCIENTIFIC MEDICAL DEVICE Ltd. (Galway, Ireland). "Medical delivery devices, assemblies, and... Read More
ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,537,234, issued on Jan. 27, was assigned to Robert Bosch GmbH (Stuttgart, Germany). "Energy store for an electrically drivable means of transpo... Read More
ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,533,931, issued on Jan. 27, was assigned to WHISKEY LIMA Corp. (Pompano Beach, Fla.). "System and method for monitoring and purging atmosphere ... Read More
ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,004, issued on Jan. 27, was assigned to CANON K.K. (Tokyo). "Imaging device" was invented by Yusuke Hirano (Kanagawa, Japan). According to... Read More
ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,537,125, issued on Jan. 27, was assigned to HITACHI ASTEMO LTD. (Ibaraki, Japan). "Solenoid, damping force adjustment mechanism, and damping fo... Read More
ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,536,128, issued on Jan. 27, was assigned to Mohan Kumar Jindal (Bangalore, India). "Device, system, and method for hardware small computer syst... Read More
ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,534,363, issued on Jan. 27, was assigned to Alliance for Energy Innovation LLC (Golden, Colo.). "Fuel additives for storage and rapid generatio... Read More
ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,598, issued on Jan. 27, was assigned to TONG HSING ELECTRONIC INDUSTRIES LTD. (Taipei, Taiwan). "Chip package structure and method for fabr... Read More